Staff Packaging Development Engineer

CÔNG TY TNHH QORVO VIỆT NAM

Địa chỉ làm việc: 5th Floor, CIC Tower building, No. 2 Lane 219 Trung Kinh Street, Cau Giay District, Hanoi

Hết hạn ngày: 20/12/2024

ID: job438864

Mô Tả Công Việc

ABOUT THE POSITION:Qorvo seeks a seasoned Packaging Development Engineer with a robust background in semiconductor packaging development and integration. This role involves leading new packaging technologies and assembly capabilities, with a focus on SMT process expertise and innovation in packaging solutions.RESPONSIBILITIES:• Develop and integrate new semiconductor packaging technologies.• Manage technical projects for packaging technology advancement.• Serve as a lead expert in packaging assembly processes, especially SMT.• Innovate in package design, processes, and materials for next-generation solutions.• Offer technical guidance during development phases and address high-volume production challenges.• Spearhead projects from concept through to qualification and production in collaboration with R&D.• Support technical customer engagements and problem resolution.• Drive continuous process improvement (CPI) in packaging and support cross-functional areas.• Collaborate with offshore assembly, substrate partners, and suppliers.• Present project updates to executive management and contribute to patent creation.

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Yêu Cầu Công Việc

• Bachelor’s degree in Mechanical, Microelectronics, or Materials Engineering. Master’s degree in Mechanical, Microelectronics, or Material Engineering preferred.• 10+ years’ experience in packaging or semiconductor assembly.• Strong leadership and project management skills in packaging and assembly tech.• Expertise in package design and SMT process development.• Experience with heterogeneous integration, SiP, and various packaging forms.• Proficiency in technology/assembly process development across SMT, Die Attach, Wire Bond, etc.• Exceptional communication skills for idea sharing and presenting to large groups.• Familiarity with high volume manufacturing, ideally in the cellular handset market.• Solid problem-solving skills; Lean and/or Six Sigma certification is a plus.• Knowledge of JEDEC, AEC Q100/200, and TS16949 automotive standards.

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Hình thức

Full-time

Mức lương

Thỏa thuận

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Địa chỉ làm việc 5th Floor, CIC Tower building, No. 2 Lane 219 Trung Kinh Street, Cau Giay District, Hanoi
Ngày đăng tuyển 21/09/2024
Vị trí Nhân viên
Ngành Nghề Kỹ sư / Sản xuất
Loại công việc Full-time
Nhà tuyển dụng CÔNG TY TNHH QORVO VIỆT NAM
LIÊN HỆ CÔNG TY TNHH QORVO VIỆT NAM
Email: đang cập nhật

Qorvo (Nasdaq: QRVO) is All Around You! We manufacture innovative RF solutions at the center of connectivity to enable high-performance applications for advanced wireless devices, wired and wireless networks and defense radar and communications for 5G networks, cloud computing, the Internet of Things, and other emerging applications. We are a global company thriving on a culture of innovation, diversity, and inclusion. Our people are always at the core of Qorvo’s innovation. Qorvo is a place to stretch your imagination and push boundaries to achieve success. It is an exciting time to be a part of Qorvo’s Infrastructure and Defense Products. Qorvo’s IDP manufactures and markets high performance RF and mixed signal integrated circuits for the communications markets that connect, protect and power the world. Our customers trust Qorvo to meet and exceed requirements and deliver advanced RF technologies to enable their most complex technical challenges and applications. Our products address connectivity both wired and wireless networks, the smart home and the IoT, broadband, aerospace, defense, and automotive. Our customers rely on us to solve the industry’s most complex engineering problems. And that takes brain power and willingness to create and innovate. Join us and help us continue to create cutting edge technologies for a more connected world all around you. Qorvo Vietnam was established in 2004 and is an emerging leader in multi-billion-dollar power management and intelligent motor drive IC markets. The portfolio of analog and mixed signal System on Chips provides scalable core platforms used in charging and powering embedded digital control systems for industrial, commercial and consumer applications. Their expertise in Power Application Controllers (PAC) and Programmable Analog ICs significantly reduce solution size and cost, improve system reliability and shorten system development cycle-time. The team, which consists of a young and vibrant workforce innovates and enables technology breakthrough in the space of analog and mixed signal integrated circuit design.